Board-level power integrity simulations within SIwave can be combined with Icepak thermal simulations to get a complete picture of a PCB’s electrothermal performance. These EM and thermal simulations help to improve wireless communications, boost signal coverage and maintain connectivity for antenna-enabled systems.īoard-Level Electrothermal Coupling (Icepak and SIwave)Įven a marginal rise in temperature can affect the performance and reliability of electronic components, leading to system-wide problems. Based on the electromagnetic and thermal coupling solutions, they can modify antenna design and predict antenna efficiency and the overall thermal and EM performance of the product. For example, electrical engineers can dynamically link Ansys HFSS and Ansys Icepak in the Electronics Desktop to simulate the temperature of the antenna. You can predict these issues before you build the hardware by simulating your design using Ansys tools.
Breakdown of a phone’s connectivity with mobile carriers, Bluetooth or Wi-Fi is traceable to thermal problems. Also, high temperatures can affect other electronic components within a phone and impact RF antenna performance. If a phone’s battery becomes too hot, it can lose charge or even create safety issues. Power hungry activity such as video calls, online-based games or varying environmental conditions causes significant swings in device temperatures. Electromagnetic Losses with Thermal Coupling For Temperature-Dependent Antenna Performance Assessment (Icepak & HFSS)Įnsuring the thermal stability of antenna-enabled 5G infrastructure, automotive radar, IoT devices and mobile electronic devices is critical in producing expected behavior.